| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
440.0 MILLIWATTS |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
80.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CZEP |
CAPITANCE RATING PER CHARACTERISTIC |
6.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CSWJ |
WORD QUANTITY (NON-CORE) |
8192 |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.5 VOLTS MAXIMUM POWER SOURCE |
| ADAQ |
BODY LENGTH |
0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
C-4 MIL-M-38510 |
| ADAT |
BODY WIDTH |
0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER |
MEMORY DEVICE TYPE |
PROM |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CRHL |
BIT QUANTITY (NON-CORE) |
65536 |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| ADAU |
BODY HEIGHT |
0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CZEQ |
TIME RATING PER CHACTERISTIC |
1000.00 NANOSECONDS MAXIMUM DELAY |
| CQZP |
INPUT CIRCUIT PATTERN |
22 INPUT |
| CBBL |
FEATURES PROVIDED |
BURN IN AND HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND ELECTROSTATIC SENSITIVE |
| TTQY |
TERMINAL TYPE AND QUANTITY |
28 LEADLESS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |