| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
0.5 VOLTS MINIMUM OUTPUT LOGIC LOW AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| ADAT |
BODY WIDTH |
0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
8 FLIP-FLOP, D-TYPE |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
149.0 MILLIWATTS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
42.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 42.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.540 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.045 INCHES MINIMUM AND 0.092 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND W/CLEAR AND W/CLOCK AND SCHOTTKY AND BURN IN AND LOW POWER |
| TTQY |
TERMINAL TYPE AND QUANTITY |
20 FLAT LEADS |
| CQZP |
INPUT CIRCUIT PATTERN |
10 INPUT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
F-9 MIL-M-38510 |