| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEP |
CAPITANCE RATING PER CHARACTERISTIC |
6.00 INPUT PICOFARADS MAXIMUM AND 10.00 OUTPUT PICOFARADS MAXIMUM |
| CBBL |
FEATURES PROVIDED |
ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND W/ENABLE AND W/INHIBIT AND MONOLITHIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
32 LEADLESS |
| CQZP |
INPUT CIRCUIT PATTERN |
26 INPUT |
| ADAU |
BODY HEIGHT |
0.105 INCHES MAXIMUM |
| FEAT |
SPECIAL FEATURES |
WITH 64-BYTE PAGE WRITE CAPABILITY |
| CSWJ |
WORD QUANTITY (NON-CORE) |
32768 |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.00 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ADAT |
BODY WIDTH |
0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| CRHL |
BIT QUANTITY (NON-CORE) |
262144 |
| CZEQ |
TIME RATING PER CHACTERISTIC |
350.00 NANOSECONDS MAXIMUM ACCESS |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
60.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CZER |
MEMORY DEVICE TYPE |
EEPROM |