| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
751G-01 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| FEAT |
SPECIAL FEATURES |
SMALL OUTLINE PACKAGE |
| CBBL |
FEATURES PROVIDED |
CASCADABLE AND W/SCHMITT TRIGGER |
| AGAV |
END ITEM IDENTIFICATION |
SCOPE SHIELD E/I FSCM 23386 |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
HEX CONTACT BOUNCE ELIMINATOR |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
6 ELIMINATOR, BOUNCE |
| CQZP |
INPUT CIRCUIT PATTERN |
6 INPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM TOTAL SUPPLY AND 18.0 VOLTS MAXIMUM TOTAL SUPPLY |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
-10.00 MILLIAMPERES COLLECTOR CUTOFF CURRENT, DC, WITH SPECIFIED RESISTANCE BETWEEN BASE AND EMITTER MICROAMPERES AND 10.00 MILLIAMPERES REVERSE CURRENT, DC MICROAMPERES |
| CQSJ |
INCLOSURE MATERIAL |
PLASTIC |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |