| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.280 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
28 PRINTED CIRCUIT |
| CZEQ |
TIME RATING PER CHACTERISTIC |
200.00 NANOSECONDS MAXIMUM ACCESS |
| CQZP |
INPUT CIRCUIT PATTERN |
25 INPUT |
| CBBL |
FEATURES PROVIDED |
HIGH IMPEDANCE AND W/DISABLE AND W/ENABLE AND STATIC OPERATION AND BIDIRECTIONAL |
| ADAQ |
BODY LENGTH |
1.380 INCHES MINIMUM AND 1.420 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
4.0 WATTS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| AGAV |
END ITEM IDENTIFICATION |
5975-01-253-6144 JUNCTION BOX |
| CSWJ |
WORD QUANTITY (NON-CORE) |
8192 |
| CZEP |
CAPITANCE RATING PER CHARACTERISTIC |
20.00 INPUT PICOFARADS MAXIMUM AND 22.00 OUTPUT PICOFARADS MAXIMUM |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
150.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| ADAT |
BODY WIDTH |
0.584 INCHES MINIMUM AND 0.604 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CRHL |
BIT QUANTITY (NON-CORE) |
65536 |
| CZER |
MEMORY DEVICE TYPE |
RAM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |