| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.092 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| FEAT |
SPECIAL FEATURES |
ESD, SOFTWARE FILE NO: 8907815-1-701, USING MODULE PMI-803063, CPU/RC 8905830 AND LOCATION U31 |
| CZER |
MEMORY DEVICE TYPE |
PAL |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| ADAQ |
BODY LENGTH |
0.540 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
16 INPUT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CZEQ |
TIME RATING PER CHACTERISTIC |
30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| ADAT |
BODY WIDTH |
0.300 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
20 FLAT LEADS |
| CRTL |
CRITICALITY CODE JUSTIFICATION |
FEAT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
F-9 MIL-M-38510 |