| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD883 STANDARD |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
MICROCIRCUITS, MEMORY, DIGITAL, CMOS 32K X 8 EEPROM, MONOLITHIC SILICON |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.3 VOLTS MINIMUM TOTAL SUPPLY AND 6.3 VOLTS MAXIMUM TOTAL SUPPLY |
| TTQY |
TERMINAL TYPE AND QUANTITY |
32 LEADLESS |
| CSWJ |
WORD QUANTITY (NON-CORE) |
32768 |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| CRTL |
CRITICALITY CODE JUSTIFICATION |
CBBL |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| FEAT |
SPECIAL FEATURES |
10 MS WRITE SPEED, BYTE/PAGE WRITE MODE, DATA POLLING/TOGGLE BIT END OFWRITE INDICATOR, 10,000 CYCLES ENDURANCE |
| AGAV |
END ITEM IDENTIFICATION |
F-16 ACFT |
| CZEQ |
TIME RATING PER CHACTERISTIC |
70.00 NANOSECONDS AF OUTPUT MEGAWATTS |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQSJ |
INCLOSURE MATERIAL |
SILICON |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| CRHL |
BIT QUANTITY (NON-CORE) |
262144 |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CZER |
MEMORY DEVICE TYPE |
EEPROM |