| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
130 FLAT LEADS |
| ADAQ |
BODY LENGTH |
2.540 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD883 STANDARD |
| FEAT |
SPECIAL FEATURES |
NHA P/N 3129305, USED ON P/NS 0500, 3405; INTERFACES TO THE HOST PROCESSOR, MICROCODE MEMORY, WEAPONS MULTIPLEX DATA, JTAG/BIST MODULE FUNCTION |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM TOTAL SUPPLY AND 6.0 VOLTS MAXIMUM TOTAL SUPPLY |
| CRTL |
CRITICALITY CODE JUSTIFICATION |
CBBL |
| CBBL |
FEATURES PROVIDED |
ELECTROSTATIC SENSITIVE AND BURN IN AND W/CLOCK |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQWX |
OUTPUT LOGIC FORM |
BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 GATE, INTERFACE |
| ADAU |
BODY HEIGHT |
0.125 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
2.540 INCHES MAXIMUM |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
MICROCIRCUIT, ASIC, DIGITAL, SERIAL COMMUNICATION |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADED CHIP CARRIER |
| AGAV |
END ITEM IDENTIFICATION |
F-16 MODULAR MISSION COMPUTER CORE CLUSTER |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |