| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.080 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD883 STANDARD |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
MICROCIRCUIT, DIGITAL, MEMORY, CACHE RAM, 16K X 9 X 2 |
| CRTL |
CRITICALITY CODE JUSTIFICATION |
CBBL |
| FEAT |
SPECIAL FEATURES |
BICAMERAL (2 BANK) CACHE RAM SPECIFICALLY DESIGNED TO SUPPORT SPLIT INSTRUCTION & DATA CACHES OF R3000 TYPE MICROPROCESSORS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CRHL |
BIT QUANTITY (NON-CORE) |
147456 |
| CQWX |
OUTPUT LOGIC FORM |
BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| TTQY |
TERMINAL TYPE AND QUANTITY |
32 PRINTED CIRCUIT |
| CSWJ |
WORD QUANTITY (NON-CORE) |
16384 |
| AGAV |
END ITEM IDENTIFICATION |
F-16 MODULAR MISSION COMPUTER CORE CLUSTER |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
4.5 VOLTS MINIMUM TOTAL SUPPLY AND 5.5 VOLTS MAXIMUM TOTAL SUPPLY |
| ADAQ |
BODY LENGTH |
0.817 INCHES MINIMUM AND 0.833 INCHES MAXIMUM |
| CZER |
MEMORY DEVICE TYPE |
RAM |
| ADAT |
BODY WIDTH |
0.395 INCHES MINIMUM AND 0.405 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
ELECTROSTATIC SENSITIVE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |