| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.358 INCHES MINIMUM |
| AGAV |
END ITEM IDENTIFICATION |
PACER DAWN |
| ADAT |
BODY WIDTH |
0.358 INCHES MINIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
550.0 MILLIWATTS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
G-2 MIL-M-38510 |
| CRTL |
CRITICALITY CODE JUSTIFICATION |
CBBL |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND PROGRAMMABLE AND POSITIVE OUTPUTS AND BURN IN AND ELECTROSTATIC SENSITIVE |
| CZER |
MEMORY DEVICE TYPE |
PAL |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CQZP |
INPUT CIRCUIT PATTERN |
16 INPUT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CZEQ |
TIME RATING PER CHACTERISTIC |
30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAU |
BODY HEIGHT |
0.100 INCHES MINIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| TTQY |
TERMINAL TYPE AND QUANTITY |
20 LEADLESS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |