| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 128K X 8 STATIC RANDOM ACCESS MEMORY (SRAM) LOW POWER |
| CQZP |
INPUT CIRCUIT PATTERN |
25 INPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| CZEP |
CAPITANCE RATING PER CHARACTERISTIC |
12.00 INPUT PICOFARADS MAXIMUM AND 14.00 OUTPUT PICOFARADS MAXIMUM |
| CSWJ |
WORD QUANTITY (NON-CORE) |
131072 |
| TTQY |
TERMINAL TYPE AND QUANTITY |
32 PIN |
| CRTL |
CRITICALITY CODE JUSTIFICATION |
CBBL |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
125.00 MILLIAMPERES PEAK FORWARD SURGE CURRENT PASCAL |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
1.630 INCHES MINIMUM AND 1.670 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ADAU |
BODY HEIGHT |
0.440 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CZER |
MEMORY DEVICE TYPE |
RAM |
| CRHL |
BIT QUANTITY (NON-CORE) |
1048576 |
| AGAV |
END ITEM IDENTIFICATION |
F15I |
| CZEQ |
TIME RATING PER CHACTERISTIC |
35.00 NANOSECONDS NOMINAL ACCESS |
| ADAT |
BODY WIDTH |
0.090 INCHES MINIMUM AND 0.130 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |