| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| CZEQ |
TIME RATING PER CHACTERISTIC |
23.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 23.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAT |
BODY WIDTH |
0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
C-2 MIL-M-38510 |
| CQZP |
INPUT CIRCUIT PATTERN |
TRIPLE 3 INPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
300.0 MILLIWATTS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
3 GATE, NAND |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADED CHIP CARRIER |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
CERAMIC CHIP CARRIER ASSY, FLAT J-LEAD |
| AGAV |
END ITEM IDENTIFICATION |
A/G-18 DCN CAGE 76301 |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CBBL |
FEATURES PROVIDED |
HIGH SPEED AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| ADAU |
BODY HEIGHT |
0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| FEAT |
SPECIAL FEATURES |
ADDING J-LEAD TO 5962-3865002B2A |
| TTQY |
TERMINAL TYPE AND QUANTITY |
20 J-HOOK |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |