| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| CBBL |
FEATURES PROVIDED |
HIGH SPEED AND LOW POWER AND ELECTROSTATIC SENSITIVE AND BURN IN, MIL-STD-883, CLASS B |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
64K ASYNCHRONOUS SPRAM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 MEMORY, STATIC RAM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM INPUT AND 0.5 VOLTS MAXIMUM INPUT |
| ADAQ |
BODY LENGTH |
1.050 INCHES MINIMUM AND 1.080 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
22 PRINTED CIRCUIT |
| ADAT |
BODY WIDTH |
0.285 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.125 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CZEQ |
TIME RATING PER CHACTERISTIC |
35.00 NANOSECONDS NOMINAL ACCESS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| AGAV |
END ITEM IDENTIFICATION |
6625-01-324-1523 |