| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.358 INCHES NOMINAL |
| FEAT |
SPECIAL FEATURES |
SHALL MEET REQUIREMENTS OF MIL-M-38510/33904B2X; AND DEVICE SHALL BE CAPABLE OF MEETING AN ESD LEVEL OF A CLASS 2 MINIMUM |
| ADAT |
BODY WIDTH |
0.358 INCHES NOMINAL |
| ADAU |
BODY HEIGHT |
0.100 INCHES NOMINAL |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
83.0 MILLIWATTS |
| AGAV |
END ITEM IDENTIFICATION |
UNIVERSAL EXCITER UPGRADE |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
8 BUFFER |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
MICROCIRCUIT, DIGITAL-BIPOLAR, ADVANCED SCHOTTKY TTL, BIPOLAR, OCTAL BUFFERS, MONOLITHIC SILICON |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC AND BIPOLAR AND SCHOTTKY AND 3-STATE OUTPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| TTQY |
TERMINAL TYPE AND QUANTITY |
20 LEADLESS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |