| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 6 INPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 20.5 VOLTS MAXIMUM POWER SOURCE |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+125.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| CBBL |
FEATURES PROVIDED |
MEDIUM SPEED AND MONOLITHIC AND HERMETICALLY SEALED AND RESETTABLE AND W/STORAGE AND W/STROBE AND POSITIVE OUTPUTS AND 3-STATE OUTPUT |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 PRINTED CIRCUIT |
| ADAT |
BODY WIDTH |
0.480 INCHES MINIMUM AND 0.520 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
| CZEQ |
TIME RATING PER CHACTERISTIC |
120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| ADAQ |
BODY LENGTH |
1.150 INCHES MINIMUM AND 1.220 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
-0-015-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 LATCH |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CRHL |
BIT QUANTITY (NON-CORE) |
8 |