| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZZZ |
MEMORY CAPACITY |
8K X 8 |
| ADAT |
BODY WIDTH |
0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
25.00 NANOSECONDS NOMINAL ACCESS |
| CBBL |
FEATURES PROVIDED |
BURN IN, MIL-STD-883, CLASS B AND LOW POWER AND ELECTROSTATIC SENSITIVE |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM TOTAL SUPPLY AND 7.0 VOLTS MAXIMUM TOTAL SUPPLY |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| FEAT |
SPECIAL FEATURES |
DATA RETENTION |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
110.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| ADAQ |
BODY LENGTH |
0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADLESS FLAT PACK |
| CZER |
MEMORY DEVICE TYPE |
RAM |
| ADAU |
BODY HEIGHT |
0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
C12 MIL-M-38510 |
| TTQY |
TERMINAL TYPE AND QUANTITY |
28 LEADLESS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |