| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
ASYNCHRONOUS AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND LOW POWER AND INTERNALLY COMPENSATED AND EXPANDABLE AND SELECTED ITEM |
| CZZZ |
MEMORY CAPACITY |
2048WORDSX9BITS |
| CQZP |
INPUT CIRCUIT PATTERN |
9 INPUT AND 13 INPUT |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
MICROCIRCUIT, PLASTIC ENCAPSULATED (SURFACE MOUNT) - PROCUREMENT AND SELECTION REQUIREMENTS (FOR SERIAL FIFO) |
| ADAQ |
BODY LENGTH |
0.653 INCHES NOMINAL |
| ADAT |
BODY WIDTH |
0.653 INCHES NOMINAL |
| CZER |
MEMORY DEVICE TYPE |
FIRST-IN FIRST-OUT |
| CRTL |
CRITICALITY CODE JUSTIFICATION |
CBBL |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.0 VOLTS NOMINAL POWER SOURCE AND 2.0 VOLTS MINIMUM INPUT LOGIC 1 AND 0.8 VOLTS MAXIMUM INPUT LOGIC 0 |
| ADAU |
BODY HEIGHT |
0.172 INCHES NOMINAL |
| TTQY |
TERMINAL TYPE AND QUANTITY |
44 J-HOOK |
| CQSZ |
INCLOSURE CONFIGURATION |
LEADED CHIP CARRIER |
| FEAT |
SPECIAL FEATURES |
CMOS PARALLEL/SERIAL FIFO USING 5O MHZ SERIAL INPUT/OUTPUT FREQUENCY |
| SPCL |
SPECIAL TEST FEATURES |
IDT42103L35J IS 100 PERCENT UPSCREENED PER PARA 3.1.1 OF DWG 89954/356A1407 BY APPROVED TEST FACILITY PIKES PEAK TEST LAB OR AMKOR TEST SERVICE FOR OPERATION IN TEMPERATURES OF -55C TO +125C. |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
MS-018-AC JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AGAV |
END ITEM IDENTIFICATION |
C-17A |
| CQSJ |
INCLOSURE MATERIAL |
PLASTIC |