| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
MICROCIRCUIT, MEMORY, DIGITAL, SRAM, 512K X 8 BIT, MONOLITHIC SILICON |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
10.80 MILLIMETERS MINIMUM AND 11.05 MILLIMETERS MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.1 WATTS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM ABSOLUTE INPUT AND 7.0 VOLTS MAXIMUM ABSOLUTE INPUT |
| ABKW |
OVERALL HEIGHT |
3.54 MILLIMETERS MINIMUM AND 4.67 MILLIMETERS MAXIMUM |
| ADAQ |
BODY LENGTH |
23.00 MILLIMETERS MINIMUM AND 23.62 MILLIMETERS MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 MEMORY, STATIC RAM |
| CZZZ |
MEMORY CAPACITY |
512K X 8 |
| FEAT |
SPECIAL FEATURES |
ABSOLUTE MAXIMUM LEAD TEMPERATURE, SOLDERING FOR 10.0 SECONDS, IS 300.0 DEGREES CELCIUS |
| CQSJ |
INCLOSURE MATERIAL |
SILICON |
| CZEQ |
TIME RATING PER CHACTERISTIC |
45.00 NANOSECONDS AF OUTPUT MEGAWATTS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
36 J-HOOK |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |