| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| ADAQ |
BODY LENGTH |
1.430 INCHES MINIMUM AND 1.485 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-25.0 MILLIVOLTS MINIMUM OUTPUT AND 25.0 MILLIVOLTS MAXIMUM OUTPUT |
| CZER |
MEMORY DEVICE TYPE |
EPROM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+135.0 DEG CELSIUS |
| FEAT |
SPECIAL FEATURES |
HIGH-DENSITY AND PERFORMANCE; 32 MACROCELLS 64 EXPANDER PRODUCT TERMS IN ONE LAB; 8 DEDICATED INPUTS 16 I/O PINS; ADVANCED 0.65-MICRO CMOS EPRON TECHNOLOGY; 28-PIN 300-MIL DIP; REPLACES MULTI-CHIP TTL SOLUTIONS WHETHER SYNCHRONOUS, ASYNCHRONOUS, COMBINATORIAL, OR ALL 3 |
| ADAT |
BODY WIDTH |
0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| AFGA |
OPERATING TEMP RANGE |
-40.0/+85.0 DEG CELSIUS |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CBBL |
FEATURES PROVIDED |
HIGH PERFORMANCE AND MACROLOGIC |
| MDCL |
MATERIAL DOCUMENT AND CLASSIFICATION |
MIL-STD-1835 MIL SPEC SINGLE MATERIAL RESPONSE |
| CQSJ |
INCLOSURE MATERIAL |
PLASTIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
28 PIN |