| CZEQ |
TIME RATING PER CHACTERISTIC |
15.00 NANOSECONDS NOMINAL ACCESS |
| CBBL |
FEATURES PROVIDED |
ASYNCHRONOUS AND SYNCHRONOUS AND PROGRAMMABLE AND HIGH PERFORMANCE |
| ADAQ |
BODY LENGTH |
19.9 MILLIMETERS MINIMUM AND 20.1 MILLIMETERS MAXIMUM |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
MS-026BHB JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CZER |
MEMORY DEVICE TYPE |
FIRST-IN FIRST-OUT |
| CXCY |
PART NAME ASSIGNED BY CONTROLLING AGENCY |
3.3 VOLT HIGH DENSITY SUPERSYNC II 36 BIT FIFO 65,536 X 36 |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ABHP |
OVERALL LENGTH |
21.9 MILLIMETERS MINIMUM AND 22.1 MILLIMETERS MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
3.3 VOLTS NOMINAL INPUT |
| AFGA |
OPERATING TEMP RANGE |
-40.0/+85.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
1.6 MILLIMETERS MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
128 GULLWING |
| ADAT |
BODY WIDTH |
13.9 MILLIMETERS MINIMUM AND 14.1 MILLIMETERS MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
PLASTIC |
| ABMK |
OVERALL WIDTH |
15.9 MILLIMETERS MINIMUM AND 16.1 MILLIMETERS MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |