7050-01-546-4634 ( M393T5750BY0(3) , 370-6209 )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 7050-01-546-4634 | 7050 | 015464634 | COMPUTER SUBASSEMBLY | 3556 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| FEAT | SPECIAL FEATURES | EXPANSION KIT ROHS;Y 2GB DDR2 DIMM, 533MHZ, ROHS;Y |
| AGAV | END ITEM IDENTIFICATION | 0091902-03(29355), SERVER T2000-3 |
| CXCK | COMPONENT TYPE AND QUANTITY | 1 MODULE |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| M393T5750BY0(3) | 0DUN9 | A | 2 | 3 | 3 | ZZ | |
| 370-6209 | 7X430 | A | 2 | 3 | 3 | ZZ |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| M393T5750BY0(3) | 0DUN9 | SAMSUNG SEMICONDUCTOR INC | F | A |
| 370-6209 | 7X430 | SUN MICROSYSTEMS INC. | A | A |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | 5 | X | A | 1 | 12/18/2 | N | 8473500000 | 3556 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|---|---|---|---|---|
| DS | I | ||||
| DN | 9B--00- | N |
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|---|---|---|---|---|
| A | A | N | 5 | X |
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|---|---|---|---|---|---|---|---|---|
| DS | SMS | J | 1 | PR | 0 | U | D | ||
| DN | SMS | J | 1 | PR | 0 | U | 9B--00- | N |
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|